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机译:
机译:Some mechanical properties of an epoxy resin system cured with multiple crosslinking agents
机译:Synthesis, Characterization and Glass Reinforcement of DimethyIolurea-3-AminoPhenol-Epoxy Resin Curing Systems
机译:Curing kinetics and thermal property characterization of bisphenol-F epoxy resin and MeTHPA system
机译:具有可调性负有效参数的主动弹性超材料(Meta-Mechanical-Systems)
机译:analysis of Curing Reaction for Epoxy Resin Used for Electrical Insulators: part I Kinetic analysis of Curing Reaction
机译:体外致突变性测试。 I.Kermide 601Resin,sylgard 184Encapsulating Resin和sylgard 184Curing agent。