Preparation of Silver/PMMA Beads via the in Sito Reduction of a Silver Alkylcarbamate Complex

摘要

The deposition of metal on non-conducting substrates by electroless deposition is being increasingly used to fabricate electronic circuits.In a typical electroless operation,a target surface is immersed in a plating solution,which consists of metal ions and a mild reducing agent.Often,a metal catalyst is required to facilitate auto-catalytic deposition of the metal.An important prerequisite for electroless deposition is the slow transfer of electrons from the reducing agent to metal ions to prevent metal ions being reduced other than on the target substrate.Recently,polyelectrolytes,sugar,sulfonation and amine derivatives have been used to deposit silver and gold on substrates.