This report is discussing a numerical study on rapid solidification of metal melt on cooling substrate. The heat source method and a numerical algorithm based on the finite element method are used. The results for the initial stage of the process are compared to those obtained by the Stefan-Schwartz analytical solution. The effect of the heat transfer coefficient at the contact surface substrate/ribbon on the cooling rate is shown. Rapid solidification of 105 μm thick melt layer is investigated. Coefficients of heat transfer between the ribbon and substrate in the range of 5×10~4 -l×l0~7 w/m~2K are used. Mean cooling velocities of ribbon/melt system are determined. Temperature field with its characteristic regions of liquid -intermediate zone - solid is shown.
展开▼
