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Boron Doped a-SiO x :H Prepared by H 2 Diluted SiH 4 +CO 2 Plasma

机译:H 2 稀释 SiH 4 +CO 2 等离子体制备硼掺杂的 a-SiO x :H

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This paper reports the preparation of hydrogenated amorphous silicon oxide (a-SiOx:H) thin films byusing plasma enhanced chemical vapor deposition (PECVD) technique at various doping ratios ofdiborane/silane(RB=B2H6/SiH4=0 0.75 1.5 4.5 7.5), and different carbondioxide/silane gas flow ratios (RC=CO2/SiH4=0 and 1) at a substrate temperature of 200(TS =200, a process pressure of 220Pa, a hydrogen dilution ratio (RH=H2/SiH4=200) and a power-2 density of 1Wcm . We investigated the effect of various borane doping concentration on themicrostrcture, optical and electrical properties of as prepared p-type a-SiOx:H thin films via Ramanspectroscopy, X-ray diffraction spectrum, ultraviolet visible light transmission spectrum (UV-VIS) andvariable temperature resistance measurement method. It was found that, with the increasing of borondoping ratios, the optical band gap decreases but the refractive index increases. The dark conductivityof doped amorphous films increases monotonously with the increasing of boron doping content, whilethe dark conductivity of doped a-SiOx:H films is not only determined by the concentration of dopantbut also the crystallinity and oxygen content of the films. As increasing RB, the crystallinity of dopedc-Si:H and a-SiOx:H films simultaneously decreases, which causes the decrease of dark conductivity.-1 -1Finally, B-doped a-SiOx:H thin films with a highest dark conductivity of 0.048 cm have beprepared.
机译:本文报道了在200(TS =200)的衬底温度下,采用等离子体增强化学气相沉积(PECVD)技术制备了氢化无定形氧化硅(a-SiOx:H)薄膜,该技术在二硼烷/硅烷(RB=[B2H6]/[SiH4]=0.75%)和不同二氧化碳/硅烷气体流量比(RC=[CO2]/[SiH4]=0和1)下制备了氢化非晶态氧化硅(a-SiOx:H) 薄膜。 工艺压力为220Pa,氢气稀释比(RH=[H2]/[SiH4]=200),幂-2密度为1Wcm。采用拉曼光谱、X射线衍射光谱、紫外可见光透射光谱(UV-VIS)和变温电阻测量方法,研究了各种硼烷掺杂浓度对p型a-SiOx:H薄膜的微观结构、光学和电学性能的影响。研究发现,随着硼掺杂比的增加,光学带隙减小,折射率增大。掺杂非晶薄膜的暗导电性随着硼掺杂量的增加而单调增加,而掺杂的a-SiOx:H薄膜的暗导电性不仅取决于掺杂剂的浓度,还取决于薄膜的结晶度和氧含量。随着RB的增加,掺杂的Si:H和a-SiOx:H薄膜的结晶度同时降低,导致暗导率下降.-1 -1最后,制备了B掺杂的a-SiOx:H薄膜,其最高暗导率为0.048 cm.

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