Active flatness control of a large-scale silicon-wafer slicer cutting a crystal ingot (Feedback vibration controller for ID sawblade)

摘要

We deal with the problem of vibration control of a silicon wafer slicing blade cutting a crystal ingot. Transverse vibration is detrimental to the cutting performance of the slicing ID sawblade. A feedback control scheme is introduced to suppress the vibration of the blade under lateral dynamic disturbance. The rotating sawblade is clamped at the outer boundary and stressed initially in the radial direction, while the inner periphery is subjected to both stationary in-plane and dynamic lateral slicing loads from the workpiece. Furthermore, the normal pneumatic forces controlled by the PD algorithm are applied to the blade to control the vibration. Numerical results are presented for an actual SUS301 blade cutting a 6"-diameter silicon ingot at 1 550 rpm. The optimal positions of the sensors and the applied control forces are studied in detail. Results obtained show that the PD controller effectively suppresses the vibration and improves the flatness of the rotating slicing blade.