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首页> 外文期刊>Applied and Environmental Microbiology >Contact killing of bacteria on copper is suppressed if bacterial-metal contact is prevented and is induced on iron by copper ions
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Contact killing of bacteria on copper is suppressed if bacterial-metal contact is prevented and is induced on iron by copper ions

机译:如果防止细菌与金属接触,则铜上的细菌接触杀伤被抑制,铜离子在铁上诱导

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Bacteria are rapidly killed on copper surfaces, and copper ions released from the surface have been proposed to play a major role in the killing process. However, it has remained unclear whether contact of the bacteria with the copper surface is also an important factor. Using laser interference lithography, we engineered copper surfaces which were covered with a grid of an inert polymer which prevented contact of the bacteria with the surface. Using Enterococcus hirae as a model organism, we showed that the release of ionic copper from these modified surfaces was not significantly reduced. In contrast, killing of bacteria was strongly attenuated. When E. hirae cells were exposed to a solid iron surface, the loss of cell viability was the same as on glass. However, exposing cells to iron in the presence of 4 mM CuSO_4 led to complete killing in 100 min. These experiments suggest that contact killing proceeds by a mechanism whereby the metal-bacterial contact damages the cell envelope, which, in turn, makes the cells susceptible to further damage by copper ions.
机译:细菌在铜表面被迅速杀死,并且从表面释放的铜离子已被提出在杀死过程中起主要作用。然而,目前尚不清楚细菌与铜表面的接触是否也是一个重要因素。使用激光干涉光刻技术,我们设计了铜表面,这些表面覆盖着惰性聚合物的网格,以防止细菌与表面接触。使用平肠球菌作为模式生物,我们发现这些修饰表面的离子铜释放没有显着减少。相比之下,对细菌的杀伤力大大减弱。当 E. hirae 细胞暴露于固体铁表面时,细胞活力的损失与玻璃相同。然而,在4mM CuSO_4存在下将细胞暴露于铁导致在100分钟内完全杀灭。这些实验表明,接触杀伤是通过金属-细菌接触破坏细胞包膜的机制进行的,这反过来又使细胞容易受到铜离子的进一步损害。

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