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ARE TODAY'S TOOLS MEETING FA'S NEEDS?

机译:今天的工具满足FA的需求吗?

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摘要

Technologies are still moving to the nanometer scale, with the technology node already at 14 nm, new materials with high-k dielectric and metal gates, new transistor architecture with FinFETs, complex multicore architectures, and very high-density integration. All the design tools, including design for test, design for manufacturing, and design-in reliability, have been refined and merged to speed up time-to-market and improve yield and reliability, while the latest wafer fabs are already well equipped to manufacture up-todate and future very-large-scale integration (VLSI). Nevertheless, failure and technological analyses are still mandatory to solve unforeseen issues and to optimize the whole process. This creates incredible challenges for tool manufacturers to fulfill the needed optical resolution for backside analysis, to develop new nanoprobing tools for electrical characterization, and to target ultimate physical and chemical resolution (analytical transmission electron microscopy, atomic probe, etc.). Developing these tools is more and more expensive, while up-to-date wafer fab facilities and the design cost of ultimate VLSI allow fewer and fewer players and factories into the market. One of the results is the high cost of tools, and another result, more linked to device technology, is the need for more and more skilled specialists to manage the analysis and to interpret the analysis results. Fortunately, the mass-market economic impact is so high that integrated circuit (IC) manufacturers are continuing the effort to obtain the necessary tools and to pay the right price for them. Therefore, there is a kind of balance that smooths the trends of fewer customers and more expensive tools on one side versus motivated IC manufacturers on the other. In this ultimate technology field, today's tools are meeting our needs, and we can remain quite confident for the next several years, but not forever, regarding the technical, scientific, and cost challenges that tool manufacturers face in developing new tools. This problem has been clearly identified, and the first Circuit Analysis Tool program has been set up to help develop needed tools and techniques.
机译:技术仍在向纳米级发展,技术节点已经达到14 nm,具有高k介电和金属栅极的新材料,具有FinFET的新晶体管架构,复杂的多核架构,以及超高密度集成。所有设计工具,包括用于测试的设计,用于制造的设计以及设计在设计中的可靠性,已经过完善和合并,以加快产品上市时间并提高良率和可靠性,而最新的晶圆厂已经具备了完善的制造能力最新和未来的超大规模集成(VLSI)。尽管如此,故障和技术分析对于解决不可预见的问题和优化整个过程仍然是必不可少的。这给工具制造商带来了难以置信的挑战,以使其满足背面分析所需的光学分辨率,开发用于电学表征的新型纳米探测工具,并瞄准最终的物理和化学分辨率(分析型透射电子显微镜,原子探针等)。开发这些工具的成本越来越高,而最新的晶圆厂设施和最终VLSI的设计成本使进入市场的参与者和工厂越来越少。结果之一是工具成本高昂,而另一个结果与设备技术更加相关,是需要越来越多的熟练专家来管理分析和解释分析结果。幸运的是,大众市场的经济影响是如此之大,以至集成电路制造商正在继续努力获得必要的工具并为其支付正确的价格。因此,存在一种平衡点,一方面可以使较少的客户和较昂贵的工具,而另一方面的IC制造商则可以降低这种趋势。在这个最终的技术领域中,当今的工具可以满足我们的需求,并且在接下来的几年中,我们可以对工具制造商在开发新工具时面临的技术,科学和成本挑战保持信心,但并非永远如此。已经清楚地确定了这个问题,并且已经建立了第一个电路分析工具程序以帮助开发所需的工具和技术。

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