Silicon segmentation: ASIC spin-offs seek success amid established alternatives

摘要

So, YOU'VE DECIDED that buying and hooking together off-the-shelf ASSPs (application-specific standard products), such as embedded controllers, peripheral chips, and the like, and then writing your own software, will fail to provide your design sufficient differentiation from competitors' products. As a result, you elect to tackle chip-level design. The two leading silicon-platform contenders and their respective trade-offs have by this time been extensively debated in a variety of industry forums, but if you're new to the game, here's a summary.