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Transverse acoustoelectric voltage measurements of GaAs grown directly on (100) Si substrates

机译:直接在 (100) 硅衬底上生长的 GaAs 的横向声电电压测量

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Transverse acoustoelectric voltage (TAV) measurements have been analyzed as a function of incident photon energy, dc bias voltage, temperature, and surface acoustic wave (SAW) frequency of GaAs layer (∼1.4 mgr;m thick) grown on a vicinal Si(100) substrate by molecular‐beam epitaxy. The TAV technique is used to show that the band gap and impurity level transitions are of slightly lower energies, compared to the bulk GaAs. This might be due to the residual strain changes in the band structure of GaAs grown on Si. It is also noticed that the presence of an interface considerably changes the shape of the experimental TAV versus bias voltage at low temperatures. Drastic variations of TAV as a function of SAW frequency and temperature are also observed. The cause of variations is not yet clear, but possible explanations are discussed.
机译:横向声电电压 (TAV) 测量已被分析为入射光子能量、直流偏置电压、温度和通过分子和连字符束外延在附近 Si(100) 衬底上生长的 GaAs 层(∼1.4 &mgr;m 厚)的表面声波 (SAW) 频率的函数。TAV技术用于表明,与体GaAs相比,带隙和杂质能级跃迁的能量略低。这可能是由于在硅上生长的砷化镓能带结构的残余应变变化所致。还值得注意的是,界面的存在会显着改变实验TAV的形状与低温下的偏置电压。还观察到 TAV 随 SAW 频率和温度的变化。变化的原因尚不清楚,但讨论了可能的解释。

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