The crystallization of an amorphous TiSi2evaporated film has been studied on both poly‐Si and SiO2substrates. A metastable form of TiSi2(base‐centered orthorhombic;a=3.62 A,b=13.76 A, andc=3.605 A) P. G. Cotter, J. H. Kohn, and R. A. Potter, J. Am. Ceram. Soc.39,11 (1956) is formed first at a temperature of approximately 350 °C on both substrates. This phase consumes the entire amorphous layer before undergoing a polymorphic transformation to face‐centered orthorhombic TiSi2(a=8.24 A,b=4.78 A, andc=8.54 A) F. Laves and H. J. Wallbaum, Z. Kristallogr.101,78 (1979) at 600 and 800 °C on poly‐Si and SiO2, respectively. These transformations were investigated usinginsituresistivity, x‐ray diffraction, and transmission electron microscopy. The room‐temperature resistivities observed were 96 and 20 mgr;OHgr; cm for the base‐centered and face‐centered TiSi2, respectively. The enhanced polymorphic transformation on poly‐Si over SiO2is explained by a lowering of surface energy barrier to nucleation.
展开▼
机译:在聚连字符Si和SiO2衬底上研究了无定形TiSi2蒸发膜的结晶。TiSi2 的亚稳态形式(碱基&连字符;中心正交菱形;a=3.62 A,b=13.76 A,和 c=3.605 A) [P. G. Cotter, J. H. Kohn, and R. A. Potter, J. Am. Ceram.Soc.39,11 (1956)] 首先在两个基底上大约350°C的温度下形成。该相消耗整个无定形层,然后分别在600和800°C下在poly‐Si和SiO2上进行多晶型转化,以面&连字符为中心斜交TiSi2(a=8.24 A,b=4.78 A,andc=8.54 A) [F. Laves和H. J. Wallbaum, Z. Kristallogr.101,78 (1979)]。使用原位电阻率、x&连字符射线衍射和透射电子显微镜研究了这些转变。碱基&连字符;居中和面&连字符;中心TiSi2的房间温度电阻率分别为96和20 &mgr;&OHgr; cm。Si在SiO2上增强的多晶型转化是通过降低成核的表面能势垒来解释的。
展开▼