Several analytical tools are applied to characterize vertical‐cavity surface‐emitting laser structures grown on GaAs wafers. These epitaxial structures are amenable to x‐ray, electron‐beam, and optical metrologies. Cross‐sectional scanning electron microscopy and transmission electron microscopy were used to measure layer thicknesses and uniformity. Photoluminescence wafer mapping was used to determine alloy composition uniformity across the wafer. Photoreflectance was also used to determine alloy composition. Cross‐sectional microphotoluminescence was used to measure average alloy compositions in the top and bottom mirrors. Reflectance spectroscopy was used to characterize the cavity resonances and mirror layers. Double‐crystal x‐ray diffractometry (DCXRD) was used to characterize mirror layer dimensions, uniformity, and average alloy composition. Excellent agreement was found among these measurement techniques and between simulations and measurements. The results demonstrate the accuracy of the device simulation tools and the applicability of DCXRD in analyzing these structures.
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