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Growth, physical properties, and adhesion of copper‐polyphenylquinoxaline interfaces

机译:铜连字符-聚苯基喹喔啉界面的生长、物理性质和粘附

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Monochromatized x‐ray photoelectron spectroscopy, contact angle measurements, and peeling tests have been used to investigate the physicochemical surface properties of polyphenylquinoxaline (PPQ) and of copper‐PPQ interfaces. The surface composition and oxygen content of a polymer that was deliberately oxidized by ultraviolet exposure in air were determined, and monitored during the anneal (up to 400 °C) of this thermostable polymer. Subsequent copper deposition in the monolayer range and film growth is characterized by small cluster formation, before percolation into a conducting metallic layer. Further anneal of the Cu‐PPQ interface is seen to promote diffusion of Cu into the polymer, and to catalytically degrade the interface by oxidizing the polymer. These observations are correlated with peeling test measurements on the same Cu‐PPQ interfaces: UV treatment combined with an anneal process are shown to be deleterious to the mechanical properties of the interface.
机译:单色x&连字符射线光电子能谱、接触角测量和剥离试验已被用于研究聚苯基喹喔啉(PPQ)和铜&连字符-PPQ界面的物理化学表面性质。测定了在空气中被紫外线照射故意氧化的聚合物的表面成分和氧含量,并在该热稳定聚合物的退火(高达400°C)期间进行监测。随后在单层范围内沉积铜和薄膜生长的特征是小团簇形成,然后渗入导电金属层。Cu‐PPQ界面的进一步退火可促进Cu扩散到聚合物中,并通过氧化聚合物催化降解界面。这些观察结果与相同Cu&连字符;PPQ界面上的剥离测试测量结果相关:UV处理与退火过程相结合,对界面的机械性能有害。

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