Schottky barrier rectifying contacts usinge‐beam‐deposited platinum have been demonstrated onn‐type bgr;‐SiC. The electrical properties of these contacts were examined as a function of annealing temperature usingI‐VandC‐Vmeasurements. Auger analysis was used to study the metallurgical reactions at the Pt/SiC interface. Short annealing cycles in the 350–800 °C temperature range led to formation of a mixed structure of PtSixand PtC at the interface, evidenced by migration of platinum into the SiC above 350 °C. The barrier height was found to increase from 0.95 to 1.35 eV with increasing annealing temperature. The rectifying characteristics improved following an initial 350 °C anneal and remained relatively stable up to 800 °C.
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机译:肖特基势垒整流触头使用&连字符;梁&连字符;沉积铂已证明 onn&连字符;类型 &bgr;‐SiC。使用I‐VandC‐V测量值检查了这些触点的电气特性作为退火温度的函数。采用俄歇分析研究了Pt/SiC界面的冶金反应。在350-800°C的温度范围内,短退火循环导致在界面处形成PtSix和PtC的混合结构,铂在350°C以上迁移到SiC中就是证明。 结果表明,随着退火温度的升高,势垒高度从0.95 eV增加到1.35 eV。在初始 350 °C 退火后,精馏特性得到改善,并在 800 °C 下保持相对稳定。
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