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Interface properties of thin oxides grown on strained GexSi1−xlayer

机译:在应变的GexSi1−xlayer上生长的薄氧化物的界面特性

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The electrical and chemical properties of the interfaces of thin oxides grown on strained GexSi1−xlayers are analyzed in detail using capacitance‐voltage measurements and Auger electron spectroscopy. It is found that the electrical properties (interface states and fixed oxide charges) of the interface depend on various parameters such as oxidation temperature, oxidation time, Ge distribution near the interface, and Ge distribution in the entire epilayer. The Ge distribution at the interface can be described using concentration‐dependent diffusivity of Ge in the epilayer. The electrical properties are improved with the increase in oxidation temperature, but for a given oxidation temperature, the quality of the interface degrades with the increase in oxidation time. At a very high oxidation temperature the Ge distribution in the entire epilayer is altered due to the high diffusivity of Ge.
机译:使用电容&连字符电压测量和俄歇电子能谱详细分析了在应变的GexSi1−xlayer上生长的薄氧化物界面的电学和化学性质。研究发现,界面的电学性质(界面态和固定氧化物电荷)取决于氧化温度、氧化时间、界面附近的Ge分布和整个外延层的Ge分布等各种参数。界面处的Ge分布可以用Ge在外延层中的浓度和连字符依赖性扩散率来描述。电性能随着氧化温度的升高而改善,但对于给定的氧化温度,界面的质量会随着氧化时间的增加而降低。在非常高的氧化温度下,由于Ge的高扩散率,整个外延层中的Ge分布发生了变化。

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