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首页> 外文期刊>電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials >Improvement of circuit-speed of HEMTs IC by reducing the parasitic capacitance
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Improvement of circuit-speed of HEMTs IC by reducing the parasitic capacitance

机译:Improvement of circuit-speed of HEMTs IC by reducing the parasitic capacitance

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摘要

We developed a process technology to remove parasitic capacitance around gate electrode originated in interconnecting layer of circuits. This process enabled us to increase the operating speed of integrated circuit, and we reported 90 GHz operation of a static T-FF circuit. We evaluated S-parameter precisely and confirmed the effect of reducing parasitic capacitance. This process technology has potential to further improve cutoff frequency, f{sub}T, by further reducing the length of the gate electrode.

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