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Measurement of thermoelectric coefficients at the solid‐liquid interface of highly dopedp‐type silicon

机译:高掺杂型硅固液界面热电系数的测量

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A new version of the ac/dc method has been developed to measure the Peltier coefficient pgr;msat the solid‐liquid interface and the Thomson coefficient tgr;sof the solid phase at the melting pointTf. For silicon with a boron concentration of 1×1020cm−3the results are pgr;ms=+0.19 V ±25 and tgr;s=−0.38 mV K−1±23. From the first Kelvin relation, the Seebeck coefficient at the solid‐liquid interface agr;msis found to be +0.11 mV K−1. The absolute Seebeck coefficient agr;sof the solid phase atTfcan be inferred to be +0.10 mV K−1. The experimental technique also permits the measurement of the interface motion due to thermal convection in the liquid phase.
机译:已经开发了一种新版本的 ac/dc 方法,用于测量固相和连字符液体界面的帕尔帖系数 &pgr;msat 和固相在熔点Tf 处的汤姆逊系数 &tgr;s。对于硼浓度为1×1020cm−3的硅,其结果为&pgr;ms=+0.19 V ±25%和&tgr;s=−0.38 mV K−1±23%。从第一个开尔文关系中,发现固液界面的塞贝克系数为+0.11 mV K−1。固相atTf的绝对塞贝克系数(sgr;s)可以推断为+0.10 mV K−1。该实验技术还允许测量由于液相中的热对流引起的界面运动。

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