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Effects of coherency stress and vacancy sources/sinks on interdirfusion across coherent multilayer interfaces - Part II: Interface sharpening and intermixing rate

机译:相干应力和空位源/汇对相干多层界面间灌注的影响 - 第二部分:界面锐化和混合速率

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摘要

Vacancy-mediated interdiffusion in coherent Mo/V and Cu/Ni multilayers is simulated to evaluate the effects of coherency stress and vacancy sources/sinks on interface sharpening and the intermixing rate, using the phase field model developed in a previous paper for two limiting cases: ideal vacancy sources/sinks densely distributed or not present at all. Interface sharpening stems from a large diffusion coefficient asymmetry across the interface, which in turn originates from the large difference in vacancy formation and migration energies between the two constituent layers. Remarkable sharpening is found in Mo/V multilayers either with dense or without vacancy sources/sinks, but only in Cu/Ni with a high density of sources/sinks. Sharpening is suppressed by coherency stress in Cu/Ni regardless of the existence of vacancy sources/sinks, but only promoted in Mo/V with a high density of sources/sinks. The intermixing rate is suppressed in Mo/V by the introduction of a high density of vacancy sources/sinks that are parallel or perpendicular to the interfaces, or uniformly distributed in all orientations, but only promoted in Cu/Ni by the introduction of vacancy sources/sinks that are parallel to the interfaces. The intermixing rate is promoted in Mo/V by coherency stress regardless of the existence of vacancy sources/sinks, but promoted in Cu/Ni by coherency stress only when the vacancy sources/sinks are parallel to the interface or not present at all. The effects of that part of coherency stress induced by the mismatch in atomic volumes on interface sharpening and the intermixing rate are opposite to, but dominant over, those of the stress induced by lattice creation/annihilation in vacancy sources/sinks.
机译:利用前一篇论文中针对两种极限情况开发的相场模型,模拟了相干Mo/V和Cu/Ni多层膜中空位介导的相互扩散,以评估相干应力和空位源/汇对界面锐化和混合速率的影响:理想空位源/汇密集分布或根本不存在。界面锐化源于界面上较大的扩散系数不对称性,而扩散系数不对称性又源于两个组成层之间空位形成和迁移能量的巨大差异。在具有密集或无空位源/汇的 Mo/V 多层中发现了显着的锐化,但仅在具有高密度源/汇的 Cu/Ni 中。无论空位源/汇是否存在,Cu/Ni中的相干应力都会抑制锐化,但仅在具有高密度源/汇的Mo/V中促进锐化。在Mo/V中,通过引入高密度的空位源/汇来抑制混合速率,这些空位源/汇平行于界面或垂直于界面,或均匀分布在所有方向上,但只有在Cu/Ni中通过引入平行于界面的空位源/汇来促进。无论空位源/汇是否存在,Mo/V中的相干应力都会促进混合速率,但只有当空位源/汇平行于界面或根本不存在时,相干应力才会促进Cu/Ni的混合速率。原子体积不匹配引起的相干应力对界面锐化和混合速率的影响与空位源/汇中晶格产生/湮灭引起的应力相反,但占主导地位。

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