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首页> 外文期刊>journal of applied polymer science >Heat‐resistant adhesive resins derived from bismaleimides and bisnadimides containing amide linkages
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Heat‐resistant adhesive resins derived from bismaleimides and bisnadimides containing amide linkages

机译:由含有酰胺键的双马来酰亚胺和双萘二酰亚胺衍生的耐热粘合剂树脂

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AbstractA novel class of bismaleimides and bisnadimides containing amide linkages in their backbones were synthesized and characterized. The synthesis of these polymer precursors was carried out by reacting a diamine containing amide linkages with maleic/nadic anhydride. They were alternatively prepared by reacting the monomaleamic/monoadiamic acid of an aromatic diamine (1 mol) with terephthaloyl chloride (0.5 mol) and subsequent cyclodehydration. The latter new preparation method circumvented the hydrogeneration necessary in the first method of synthesis. The monomers were characterized by infrared (IR) and proton nuclear magnetic resonance (1H‐NMR) spectroscopy. Differential thermal analysis (DTA) of monomers showed that bisnadimide and bismethylnadimide were polymerized at lower temperatures than the corresponding bismaleimide. Thermogravimetric analysis (TGA) in nitrogen and air atmosphere revealed that all polymers were stable up to 321–363°C. Their char yield at 800°C under anaerobic conditions was 4
机译:摘要合成了一类在骨架上含有酰胺键的新型双马来酰亚胺和双萘二亚胺。这些聚合物前体的合成是通过将含有酰胺键的二胺与马来酸/纳迪克酸酐反应进行的。它们通过将芳香族二胺(1 mol)的单马来酰/单二胺酸与苯二甲酰氯(0.5 mol)反应并随后的环脱水来制备。后一种新的制备方法规避了第一种合成方法中必要的水力发电。采用红外(IR)和质子核磁共振(1H‐NMR)光谱对单体进行了表征。单体的差热分析(DTA)表明,双茱二亚胺和双甲基蒲二亚胺在比相应的双马来酰亚胺更低的温度下聚合。氮气和空气气氛中的热重分析(TGA)表明,所有聚合物在321–363°C下均稳定。 厌氧条件下,800°C的焦炭产率为4

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