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Effects of impurity transitions on electroreflectance in thin epitaxial GaAs and Ga1−xAlxAs/GaAs layers

机译:杂质跃迁对薄外延砷化镓和Ga1−xAlxAs/GaAs层电反射率的影响

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A detailed electroreflectance (ER) and photoluminescence study has been performed of impurity‐related, below‐gap electroabsorption (EA) features in bulk Sn‐ and Si‐doped GaAs as well as in thin epitaxial layers of GaAs and Ga1−xAlxAs/GaAs, with and without a known carbon impurity. A correlation is observed between the below‐gap electroreflectance structure and impurity related emission from the conduction band and donor levels (when present) to acceptor states. In all cases in which impurities are present, the dc bias dependence of the EA below‐gap structure and the current through the sample are found to be similar suggesting impact ionization as the mechanism which allows observation of the impurity transitions in ER. It is also shown that regardless of the carrier type of the material, upward band bending at the sample surface is required to prevent rapid recombination and maintain empty impurity levels whose population can be modulated by impact ionization. The photoresponse of the samples verifies these observations. For thin epitaxial films, criteria are presented for reducing the effects of below‐gap structure arising from the substrate material.
机译:对体Sn‐和Si‐掺杂GaAs以及GaAs和Ga1−xAlxAs/GaAs的薄外延层中的杂质(连字符)相关、以下间隙电吸收(EA)特征进行了详细的电反射(ER)和光致发光研究,无论是否有已知的碳杂质。观察到以下&连字符间隙电反射率结构与从导带和供体水平(如果存在)到受体状态的杂质相关发射之间存在相关性。在所有存在杂质的情况下,发现以下 EA 的直流偏置依赖性&连字符间隙结构和通过样品的电流相似,表明冲击电离是允许观察 ER 中杂质转变的机制。还表明,无论材料的载体类型如何,都需要在样品表面向上弯曲带,以防止快速复合并保持空杂质水平,其杂质数量可以通过冲击电离进行调节。样品的光响应验证了这些观察结果。对于薄外延膜,提出了降低基板材料产生的以下&连字符间隙结构影响的标准。

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