Hole kinetics in metal‐oxide‐semiconductor oxides investigated by a hot‐carrier degradation experiment

摘要

In this work fast‐changing bias conditions in the nanosecond regime are applied ton‐channel metal‐oxide‐semiconductor field effect transistors. Short bunches of holes are injected into the silicon dioxide (SiO2) and subjected to different field conditions which influence the final trapping. It is shown that by this experiment the kinetics of hole movement in the oxide can be studied. The model of polaron formation originating from work on high‐energy irradiation is essentially confirmed. Evidence for a prepolaron formation phase is found, however, with a smaller scattering length for which we propose the different hole formation process in this experiment to be responsible. On this basis the interface trap formation by injected holes is investigated. It is found that not the number of trapped holes but the one of injected holes is decisive for interface trap formation.