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Depletion of interstitial oxygen in silicon and the thermal donor model

机译:硅中间隙氧的消耗和热供体模型

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Recent experimental studies which monitor the loss of oxygen interstitials during 450 °C annealing of Czochralski silicon have been argued to be in conflict with the predictions of existing thermal donor (TD) kinetic models. In this paper we show that a recently proposed model predicts an oxygen depletion rate which is in excellent agreement with the experimental findings.
机译:最近监测直拉硅450°C退火过程中氧间隙损失的实验研究被认为与现有热供体(TD)动力学模型的预测相冲突。在本文中,我们表明最近提出的模型预测了氧消耗率,这与实验结果非常吻合。

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