Effect of temperature on the variance of the loghyphen;normal distribution of failure times due to electromigration damage

摘要

To predict interconnect reliability, the mean time to failure, nature of failure time distribution, and the variance in the distribution at operating conditions must be known. The first two pieces of data can be obtained using the wellhyphen;established mean time to failure technique. It is demonstrated the effect of temperature on the variance of the failure time distribution can be found from data obtained from temperaturehyphen;ramp resistance analysis to characterize electromigration. The predicted variance is lowest at temperatures near where data were gathered, but the variance increases as the temperature approaches operating conditions.