In order to obtain high performance CMOS devices with scaled dimensions, introduction of new technologies into the front-end fabrication process are required and therefore technologies such as strained channel, metal gate, high-k gate dielectrics, thin body SOI, and multi-gate transistor, are proposed so far. Among these technologies, gate stack technology is common key issue for scaled CMOS devices. In this presentation, gate stack technology using high-k gate dielectrics and metal gate will be discussed, and recent achievements of these technologies will be reviewed.
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