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首页> 外文期刊>電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials >Physical Origin of Stress-Induced Leakage Currents in Ultra-Thin Silicon Dioxide Films
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Physical Origin of Stress-Induced Leakage Currents in Ultra-Thin Silicon Dioxide Films

机译:Physical Origin of Stress-Induced Leakage Currents in Ultra-Thin Silicon Dioxide Films

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摘要

Physical origin of stress-induced leakage currents (SILC) in ultra-thin SiO{sub}2 films is described. Assuming a two-step trap-assisted tunneling process accompanied with an energy relaxation process of trapped electrons, conditions of trap sites which are origin of SILC are quantitatively found. It is proposed that the trap site location and the trap state energy can be explained by mean-free-path of hole in SiO{sub}2 films and atomic structure of trap site by O vacancy model.
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