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Transient radiation study of GaAs metal semiconductor field effect transistors implanted in Cr‐doped and undoped substrates

机译:植入Cr�phen和未掺杂衬底中的GaAs金属半导体场效应晶体管的瞬态辐射研究

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摘要

Flash x‐ray measurements have been made on GaAs metal semiconductor field effect transistor structures fabricated in both Cr‐doped and undoped semi‐insulating substrate material in order to characterize the levels responsible for long term transients in these devices. Prominent electron and hole traps with activation energies in the 0.76–0.90‐eV range have been identified. The main electron trap, which is present in both Cr‐doped and undoped substrates, appears to be primarily responsible for the observed transient response. However, traps related to Cr‐doping also contribute to the transient behavior.
机译:已经对用Cr掺杂和未掺杂的半连字符绝缘衬底材料制造的GaAs金属半导体场效应晶体管结构进行了闪存x射线测量,以表征这些器件中导致长期瞬变的水平。已经确定了活化能在0.76–0.90‐eV范围内的突出电子和空穴陷阱。主要的电子阱存在于Cr&连字符掺杂和未掺杂的衬底中,似乎是观测到的瞬态响应的主要原因。然而,与Cr&连字符掺杂相关的陷阱也有助于瞬态行为。

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