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Studies on the improvement of cured two‐stage phenolics performance. III. Relation between conditions of heat treatment and properties of wood‐flour‐filled phenolics

机译:固化后两阶段酚醛性能的改善研究.三、热处理条件与木粉填充酚醛树脂性能的关系

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AbstractThe effect of heat treatment on the properties of cured two‐stage phenolics was studied. Samples were compression‐molded from the compound that was prepared from novolac, wood flour (100 phr), and hexamethylenetetramine (15 phr). Samples were heat‐treated in conditions of four levels for temperature (150°C, 170°C, 190°C, and 210°C) and time (4, 8, 16, and 24 h). The properties of samples heat‐treated, such as weight loss, dimensional stability, water absorption after boiling, and flexural properties were measured. The relation between the properties and the conditions of heat treatment was examined statistically. From the results, it was decided that the optimum conditions of heat treatment for practical use were: (i) to decrease water absorption and to heighten electrical resistance, 210°C, 24 h; (ii) to improve flexural properties at room temperature and at 160°C; 170°C, 8 h, and 170–190°C, 24 h, respectively. It was concluded that the decrease of water absorption of moldings was due to the increase of hydrophobic nature of wood flour included in moldings by heat treatment and that the improvement of flexural property of moldings at 160°C was due to an increase of crosslinking density by heat treatment. The reasons for the improvement of the electrical properties by heat treatment w
机译:摘要 研究了热处理对固化两阶段酚醛树脂性能的影响。样品由酚醛清漆、木粉 (100 phr) 和六亚甲基四胺 (15 phr) 制备的化合物进行压缩成型。样品在温度(150°C、170°C、190°C 和 210°C)和时间(4、8、16 和 24 小时)四个级别的条件下进行热处理。测量了热处理样品的性能,如重量损失、尺寸稳定性、煮沸后的吸水率和弯曲性能。对性能与热处理条件之间的关系进行了统计检查。根据结果,确定实际使用的最佳热处理条件是:(i)减少吸水率并提高电阻,210°C,24小时;(ii) 改善室温和160°C下的弯曲性能;分别为 170°C,8 小时和 170–190°C,24 小时。结果表明,成型件吸水率的降低是由于热处理后木粉中含有的木粉的疏水性增加,而160°C下成型件弯曲性能的改善是由于热处理增加了交联密度。通过热处理改善电气性能的原因

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