It is known that the thickness of the λ/4 type absorber having a resistive film with the capacity is thinner than 1/4 wave length. In this paper, we clarified the complex sheet resistance of the resistive film at the matching thickness of the single-layer absorber thinner than 1/4 wave length. The resistive films were fabricated by using the binder and the flake conductive powder. We carried out to grasp the complex sheet resistance of the fabricated resistive films. We have proven that the matching thickness of the single-layer absorber could be realized 0.17-009λ from 2GHz to 8GHz by using the fabricated resistive films. From the result, we designed the single-layer absorber for DSRC at 5.8GHz-band by using the fabricated resistive films. We confirmed that the thickness could be realized thinner than about 45 against 1/4 wave length, on the other hand, we designed the double-layer absorber for wireless communications at 2.4GHz-band and 5.2GHz-band by sing the fabricated resistive films. As the result, the thickness could be realized thinner than about 30 against the same type absorber using a resistive film without the capacity.
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