The impact of the 300-mm transition on silicon wafer suppliers

摘要

In the 300-mm transition, silicon wafer suppliers face challenges similar to those faced by their customers, the device makers. They must develop high-yielding, simplified processes that produce a superior product at a competitive cost; develop or procure increasingly sophisticated process equipment with a lower cost of ownership; and design factories with automated material handling systems (AMHS) and computer integrated manufacturing (CIM) to improve product quality and human productivity. Inaddition, wafer suppliers must satisfy the market demand for improved wafer features. This article reviews some of the issues facing silicon wafer suppliers and their customers.