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Invited Talk 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics

机译:Invited Talk 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics

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摘要

Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modem high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensible role in modem high speed electronic design.

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