ABSTRACTReference materials which contained either 8 or 10 bentonite pastes and very fine pure copper powder (300 mesh, 30–.55), provided thermal conductivities ranging from 0.9 to 1.9 W/mK. These materials were used to calibrate probes for measuring thermal conductivity of frozen food materials. Thermal conductivity values measured by the steady‐state (parallel plate) method, the unsteady‐state heat transfer (heating curve) method, and the probe method agreed within 5. Although experimental density and heat capacity data of copper‐filled bentonite pastes agreed with a mass average value of component properties, measured thermal conductivity values were much lower than the volume fraction average
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