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On the identification of N dangling bonds in SiN films using x‐ray absorption studies

机译:基于x连字符射线吸收研究鉴定SiN薄膜中N悬空键

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Thin amorphous Si3N4films grown on Si are studied with the near‐edge x‐ray absorption fine structure (NEXAFS) characterization technique. The N dangling bonds in N‐rich films give rise to a strong resonance line (RL) at the onset of the N 1sabsorption edge, with an intensity that increases with the N/Si ratio. Further evidence on the origin of the RL is provided by the NEXAFS spectra from nitrogen‐implanted Si and Si3N4films bombarded with Ar+ions. The RL can be annealed out after annealing at temperatures higher than the growth temperature. We propose that the annealing of the RL is due to formation of Si—N bonds, where the Si atoms are provided by the stressed interface. The velocity of the annealing process is controlled by the diffusivity of Si interstitials in the Si3N4and the process is characterized by an activation energy of 0.86 eV.
机译:采用近连字符边缘x射线吸收精细结构(NEXAFS)表征技术研究了在Si上生长的薄非晶Si3N4薄膜.富含N&连字符的薄膜中的N悬空键在N 1吸收边缘开始时产生强共振线(RL),其强度随着N/Si比的增加而增加。关于RL起源的进一步证据是由氮&连字符;注入的Si和Si3N4薄膜的NEXAFS光谱提供的,这些膜被Ar+离子轰击。RL可以在高于生长温度的温度下退火后退火。我们提出RL的退火是由于Si—N键的形成,其中Si原子由应力界面提供。退火过程的速度受Si3N4中Si间隙的扩散率控制,该过程的活化能为0.86 eV。

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