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A study of the annealing of heavily arsenic‐doped silicon using x‐ray photoelectron spectroscopy

机译:基于x射线光电子能谱的重砷连字符掺杂硅退火研究

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The effects of incoherent light rapid thermal annealing and furnace annealing of arsenic‐implanted silicon (6×1015/cm2of arsenic at 70 keV) have been studied by x‐ray photoelectron spectroscopy (XPS) and secondary‐ion mass spectrometry (SIMS). The XPS analysis revealed two chemical states of arsenic with a 0.9‐eV chemical shift of the 3dcore level, which coexisted in both the as‐implanted and annealed samples. The arsenic with a higher binding energy is interpreted as substitutional arsenic, whereas the other arsenic component is assigned as either interstitial or clustered arsenic. SIMS and XPS results also indicate that surface segregation and clustering of the implanted arsenic during annealing are enhanced by the presence of implantation‐induced structural defects.
机译:采用x连字符射线光电子能谱(XPS)和二次连字符离子质谱(SIMS)研究了砷&连字符;注入硅(70 keV下砷为6×1015/cm2)的非相干光快速热退火和炉膛退火的影响.XPS分析揭示了砷的两种化学状态,其3dcore水平的化学偏移为0.9‐eV,它们在as‐注入和退火样品中共存。具有较高结合能的砷被解释为取代砷,而另一种砷成分被指定为间隙砷或簇砷。SIMS和XPS结果还表明,在退火过程中,植入的砷的表面偏析和聚集性由于植入和连字符引起的结构缺陷的存在而增强。

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