Is an increased awareness in the industry that packaging has become a factor in electronic product cost, performance, and reliability. In some market segments, packaging already represents 25 of the total system cost, limits the power and frequency of semiconductors, and is the dominant factor in product reliability. Based on the recently completed 2001 International Technology Roadmap for Semiconductors (ITRS) assembly and packaging roadmap projections, the impact of packaging technology on future electronic systems will increase 1. To fully realize the benefits of emerging device technologies and develop competitive products for new applications, the industry must increase both basic research and advanced development of packaging technology. With the increased impact of packaging on electronic products, the industry will also need to adopt a more integrated approach to semiconductor packaging and systems design. As a result, the technology boundaries between semiconductor packaging and system technologies in electronics will blur. In many market segments, package designs can no longer be executed independently of the chip and system; they must be considered concurrently in a system-level approach to minimize suboptimization. The ability to exchange a broader range of complex design parameters among chip, package, and system is required. To effectively address higher performance, while reducing cost on a more diversified base of technology, package design is driving the increasing complexity in design process, tools, and the need for more accurate and in-depth knowledge of materials.
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