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Establishing Efficient Electrical Contact to the Weak Crystals of Triethylsilylethynyl Anthradithiophene

机译:与三乙基硅基炔丙基蒽噻吩的弱晶体建立有效的电接触

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摘要

Triethylsilylethynyl anthradithiophene(TES ADT)forms weak van der Waals crystals in the solid state because its bulky TES side groups limit intermolecular interactions.Consequently,TES ADT melts easily and locally when it experiences heat conduction from the metal evaporation process to form electrical contacts.The performance of TES ADT thin-film transistors is thus highly dependent upon the manner in which electrical contacts are established to the organic semiconductor.Bottom-contact TES ADT thin-film transistors in which the electrodes are fabricated prior to the organic semiconductor deposition routinely exhibit a charge-carrier mobility of 0.11 ± 0.05 cm~2/V·s.Top-contact thin-film transistors with electrodes patterned directly on top of TES ADT by metal evaporation through a shadow mask,on the other hand,exhibit highly variable device characteristics with a charge-carrier mobility 0.03 ±0.03 cm~2/V·s.To avoid thermal damage to TES ADT during electrode fabrication,we separately defined gold source and drain electrodes on elastomeric stamps and then laminated the electrodes against TES ADT to form top-contact devices.These laminated top-contact thin-film transistors exhibit device characteristics with minimal current-voltage hysteresis and an enhanced charge-carrier mobility of 0.19 ± 0.06 cm~2/ V·s.
机译:三乙基硅基炔基蒽噻吩(TES ADT)在固态下形成弱范德华晶体,因为其庞大的TES侧基限制了分子间的相互作用。因此,当TES ADT在金属蒸发过程中受到热传导形成电触点时,它很容易在局部熔化。因此,TES ADT薄膜晶体管的性能在很大程度上取决于与有机半导体建立电接触的方式。在有机半导体沉积之前制造电极的底部接触式TES ADT薄膜晶体管通常表现出0.11 ±0.05 cm~2/V·s的电荷载流子迁移率,另一方面,通过阴影掩模的金属蒸发,电极直接在TES ADT顶部形成电极,表现出高度可变的器件特性,电荷载流子迁移率为0.03 ±0.03 cm~2/V·s.To 避免了TES ADT在过程中的热损伤电极的制备,在弹性印章上分别定义了金源电极和漏极,然后将电极层压在TES ADT上形成顶部接触器件。这些层压式顶触头薄膜晶体管具有最小的电流电压滞后和0.19±0.06 cm~2/ V·s的增强电荷载流子迁移率。

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