A Note on the 3-D IC TSV Assignment Problem

摘要

The three dimensional (3-D) integrated circuit (IC) through-silicon via (TSV) assignment problem is to assign TSVs for 3-D nets so that the 3-D nets are routed with minimum total cost. It has been known that the problem is NP-hard for the general cost. This paper shows that the problem is NP-hard even if the cost is more practical such as the estimated routing wirelength.