Studies on the Thermal Stability of Cu(I) and Ag(I) Complexes - IIa. Mixed-Ligand Complexes of CuI and AgI with Thiourea and Heterocyclic Amines

摘要

The thermal behaviour of some mixed-ligand complexes of Cu(I) and Ag(I) formed by the interaction of Cu(tu)3I and Ag(tu)I (where tu stands for thiourea) with py, 2-pic, 3-pic, 4-pic, qu, iqu, pip, ac, bpy and phen have been studied using TGA and DTA techniques. IR spectral and X-ray diffraction analyses have been employed to identify the nature of the dissociation products. The Cu (I) complexes lose thiourea in the first step and then the heterocyclic amine whereas in case of the Ag(I) complexes, the thiourea molecule leaves only after the removal of the heterocyclic amine from the complex. The thermal behaviour of the complexes shows that Cu (I) is more tenaciously bonded with nitrogen donors whereas Ag(I) has more affinity towards sulphur containing ligands.