We study fabrication process and design opportunities for shrinking the "dead zones" in large-scale mosaic microbolometer detector arrays (MBDAs) for the infrared and terahertz regions. We perform a quantitative analysis of dead zones in mosaic photodetectors and describe the technology achievable by densely packing submodule chips into mosaic MBDAs with dead zone widths of 13-22 mu m. We have also developed address-circuit designs that minimize dead zone widths in mosaic MBDAs. (C) 2018 Optical Society of America
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