The technology of imaging for transferring a desired pattern onto the semiconductor wafer comes in the forefront in an effort to scale down geometries in LSI/VLSI. Conventionally, semiconductor imaging technology involves first fabrication of a mask and then transferring the pattern onto the wafer through lithographic techniques. Tremendous strides have been made in this area over the last decade. While the ultimate objective would be to eliminate the intermediate step of mask fabrication, it does not seem to be achieveable in the foreseable future.
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