The 3-D Packaging Era Has Begun

摘要

As Joseph Fjelstad, CEO and founder of SiliconPipe (San Jose), pointed out during a presentation about advanced packaging at SEMICON West 2007, there have been three distinct eras in the evolution of electronic assembly (Figure). These eras include through hole, surface mount and chip scale. We're still at the chip-scale era with many technologies, but the new era in packaging is 3-D — although its start admittedly dates back quite a few years.