Arsenic depth distributions in siliconhyphen;onhyphen;sapphire films, after annealing at 900thinsp;deg;C for a range of times, have been studied by Rutherford backscattering and spreading resistance techniques. A continuum pipe diffusion model is developed which accounts satisfactorily for the rapid diffusion and segregation effects observed. In addition, the same model predicts twohyphen;dimensional dopant profiles with several novel features relevant to microelectronic device processing.
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