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The high temperature corrosion resistance of α‐phase bronzes

机译:α相青铜的耐高温腐蚀性

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AbstractThe oxidation of Cu‐Sn alloys containing up to 13 wt Sn in oxygen (1 atm) has been studied in the temperature range 550 °C to 800 °C at 50 °C intervals; the investigation involved the study of the kinetics and of the morphology and structure of the scales by appropriate physical methods, with the aim of correlating the two aspects of the oxidation behaviour. The oxidation rate of a 3 wt Sn alloy is lower than for pure Cu at 550 and 600 °C, but higher above 600°C. The effect of the tin addition is related to the interplay of many different factors affecting the reaction rate, the overall result depending on temperature. The rate of oxidation of the more concentrated alloys, however, is always lower than that of pure Cu. This result is attributed to the formation of an SnO2layer at the base of the scale which, although thin and usually discontinous, slows down the outward diffusion of copper. The highest tin concentration allowed by its high temperature solubility in copper is not sufficient to produce a continous thick healing layer of SnO2at the alloy surface, but nevertheless it produces a pronounced decrease of the oxidatio
机译:摘要研究了在550 °C至800 °C温度范围内,以50 °C为间隔,在氧(1 atm)中含有高达13 wt%Sn的Cu-Sn合金的氧化作用;研究涉及通过适当的物理方法研究鳞片的动力学以及形态和结构,目的是将氧化行为的两个方面联系起来。在550°C和600°C时,3重量%Sn合金的氧化速率低于纯Cu,但在600°C以上更高。 锡添加的效果与影响反应速率的许多不同因素的相互作用有关,总体结果取决于温度。然而,更浓缩的合金的氧化速率总是低于纯铜的氧化速率。这一结果归因于在鳞片底部形成的SnO2层,尽管该层很薄且通常是不连续的,但减缓了铜的向外扩散。锡在铜中的高温溶解度所允许的最高锡浓度不足以在合金表面产生连续厚的SnO2愈合层,但它仍然会产生氧化剂的显着降低

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