机译:Effect of density on the diffusion barrier property of TiNx films between Cu and Si
Lee Ming Inst Technol, Dept Chem Engn, Taipei 243, Taiwan;
titanium nitride; bias voltage; film density; diffusion barrier; THIN-FILMS; COPPER SILICIDES; SPUTTERED TIN; METALLIZATION; MICROSTRUCTURE; PASSIVATION; CAPABILITY; DEPOSITION; OXIDATION; SILICON;