RD efforts of low-cost opto-electronic packaging technology for high-speed IT appliances were reported. The alignment accuracy of optical-waveguide film laminating technology was achieved to ±6μm, and the applicability for low-cost OE-MCM was verified. The AIP models of 3D-construction with LD, PD and interface ICs had the performance of 3 Gbps transmission. The expectation for high-performance of Tbps class was demonstrated by subrack model using optical fiber boards and fiber right-angled connectors. Self-Written Waveguide technology was developed for easy optical fiber coupling. Ultra compact optical multi/demultiplexer, which was composed of MT-ferrule, micro lenses and dielectric filters, was developed for C-WDM.
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