Back‐scatter electron images at 200 kV of subsurface structures in composite materials

摘要

SUMMARYBack‐scatter electron images of subsurface structures of higher atomic number than the matrix are obtained at accelerating voltages of 50, 100, 150 and 200 kV. Similar back‐scatter images of structures on the bottom surface of single crystal foils of copper and mica ranging in thickness from 1 to 4 μm are compared with STEM images. It is concluded that at 200 kV a reasonable resolution of structures down to 1 μm subsurface is pos