New polymeric nanocomposites were prepared by covalent bonding of nanosized octahedral silsesqui-oxane particles containing reactive glycidyl group to polyamidoimides containing a carboxy group in the pendant chain. The influence of temperature, molecular weight of the polymer, and reaction time on the covalent bonding of polyhedral oligomeric silsesquioxane (POSS) nanoparticles was revealed. The effect of the POSS nanoparticle incorporation on the structure, dielectric and deformation-strength properties, and heat resistance of the new polymeric nanocomposites was examined.
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