AbstractAn investigation has been made of the effect which an increasing hydrostatic pressure may have on copper corrosion at different temperatures in sea water at pH 7.8.The tests were carried out at a pressure of 1, 50, 100, 200 and 300 atm at a temperature of 5 °, 10 ° and 20 °C.The pressure set in which the tests were effected was pressurized by an hydropneumatic pump and it was fitted not only with a work electrode, but also with two Pt and one Ag‐AgCl reference electrodes for electrochemical tests.It was found that copper corrosion is always stimulated by a pressure rise and that the increased corrosion rate is accelerated by increasing temperatures.The maximum increase (71) was obtained at T = 20 °C; D.O = 7.0 ppm and pH = 7.8 at a pressure of 150 atm.But at a temperature of approx. 5 °C, the maximum increase did not exceed 30 always at a pressure of 150 atm.The test findings also evidenced that at a temperature ≤ of 10 °C, the pressure rise did not affect the anodic process but only the cathodic reduction, whereas the anodic process too was significantly accelerated at 20 °C and the influence of the pressure was found to be more a
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