As the millimeter wave applications are gradually transferring to the consumer market, the packaging must meet the demands for high reliability, miniaturization, lower cost, and low electrical loss. Although several surface mount package types for high frequency have been proposed to meet those requirements, the return loss starts dropping drastically around 30GHz level. This paper shows and explains the key points of the simulation and design technologies for high frequency SMT package. Then, we introduce practical examples of packages designed for high frequency by using simulation technology in order to improve the transmission properties of the package. We have manufactured prototype samples of such packages and confirmed the results of simulation by actual measurements. The measurement results show S11＜-15dB and S21＜-1dB per port up to 50 GHz (including the board interface). As for package material, we used low loss LTCC (Er = 6.0).
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