A power hybrid is any circuit solution that dissipates more than 5 W/in/sup 2/ and incorporates more than one packaging technology. There are a number of developments now used in manufacturing power hybrids, and a key one is direct-bonded-copper isolation-substrate technology. The author describes this technique as well as heavy wire bonding and other techniques. The mixing of packaging technologies is discussed and the application of power hybrids to power supplies and uninterruptible power supplies is described.
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