The semiconductor industry demands high-integrated and low-cost semiconductor devices for the high information-oriented society. Wafer current diameter is 200 mm. The practice of 300 mm diameter wafer is started to produce and furthermore 400-450 mm wafer comes into view. In the case of 300 mm or more super large wafer, the surface quality of wafer is required to be high accuracy and both side of surfaces are required to be mirror-polished. Ultra-precision double disk grinding systems are remarkably expected for manufacturing super flat wafer, instead of conventional lapping and etching processes. We have developed the ultra-precision double disk grinding machine for 400 mm silicon wafer at first in the world under a collaborative development agreement with Super Silicon Crystal Research Institute Corp., Japan. This paper describes the developed ultra-precision grinding machine including the mechanical structure, control system, some experimental evaluations of systems performance and grinding results.
展开▼
