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Structural properties of bismuth‐bearing semiconductor alloys

机译:含铋轴承半导体合金的结构性能

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Materials currently used for detection in the infrared spectral region have notoriously poor structural properties. In search of a better narrow‐gap material, we have addressed the structural properties of bismuth‐bearing III‐V semiconductor alloys theoretically. Because the Bi compounds are not known to form zinc‐blende structures, only the anion‐substituted alloys InPBi, InAsBi, and InSbBi are considered candidates as narrow‐gap semiconductors. We calculate the bond energies and lengths for the zinc‐blende Bi compounds and their diluted and concentrated alloys. Strain coefficients for the compounds are calculated, and predictions for the mixing enthalpies, miscibility gaps, and critical temperatures are made. Miscibility calculations indicate that InSbBi will be the most miscible, and because of the large lattice mismatch of the constituents, InPBi will be the most difficult to mix. Tendencies toward cluster formation and deviations from randomness in the alloys are considered. Calculations of the hardness of the Bi compounds indicate that, once formed, the InPBi alloy will be harder than the other Bi alloys and substantially harder than the currently favored narrow‐gap semiconductor HgCdTe. Thus, although InSbBi may be an easier material to prepare, InPBi promises to be a harder material. Vacancy formation energies are calculated and compared with those of the constituent compounds of narrow‐gap II‐VI alloys.
机译:目前用于红外光谱区域检测的材料具有众所周知的较差的结构性能。为了寻找更好的窄间隙材料,我们从理论上研究了含铋III型半导体合金的结构性能。由于已知Bi化合物不会形成锌&连字符-闪矿结构,因此只有阴离子&连字符取代的合金InPBi,InAsBi和InSbBi被认为是窄&连字符间隙半导体的候选者。我们计算了锌闪闪石Bi化合物及其稀释和浓缩合金的键能和长度。计算化合物的应变系数,并预测混合焓、混溶性间隙和临界温度。混溶性计算表明,InSbBi的混溶性最强,并且由于成分的晶格错配较大,InPBi将是最难混合的。考虑了合金中团簇形成的趋势和随机性的偏差。对Bi化合物硬度的计算表明,一旦形成,InPBi合金将比其他Bi合金更硬,并且比目前流行的窄间隙半导体HgCdTe硬得多。因此,尽管 InSbBi 可能是一种更容易制备的材料,但 InPBi 有望成为一种更硬的材料。计算空位形成能,并与窄&连字符;间隙II&连字符;VI合金组成化合物的空位形成能进行比较。

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